Kaabo si awọn oju opo wẹẹbu wa!

Tankii 1.0mm Tinned Ejò Waya T2 Red Ejò Anti-Oxidation & Imudara to dara julọ

Apejuwe kukuru:


  • Orukọ ọja:Tinned Ejò Waya
  • Opin:1.0mm
  • Ifarada Opin:± 0.02mm
  • Sisanra Tin:3-5μ
  • Imudara Itanna (20℃):≥98% IACS
  • Agbara fifẹ:200-250 MPa
  • Ilọsiwaju ni isinmi:≥30% (L0=200mm)
  • Iwọn iwọn otutu ti nṣiṣẹ:-40℃ ~ 150℃
  • Alaye ọja

    FAQ

    ọja Tags

    ọja Apejuwe

    1.0mm Tinned Ejò Waya (Pure Red Ejò Core, 3-5μ Tin Coating)

    ọja Akopọ

    Bi awọn kan ga-igbẹkẹle itanna adaorin lati Tankii Alloy elo, awọn1.0mm tinned Ejò wayaṣepọ awọn anfani mojuto meji: adaṣe giga-giga ti bàbà pupa funfun (ite T2) ati aabo ipata ti ibora 3-5μ tin konge. Ṣelọpọ nipasẹ Huona's to ti ni ilọsiwaju lemọlemọfún gbona-dip tinning ilana-ni ipese pẹlu gidi-akoko sisanra monitoring ati otutu-waya idaniloju tin Layer adheres iṣọkan si awọn 1.0mm ri to Ejò mojuto, ko si pits tabi tinrin to muna. O yanju awọn aaye irora bọtini meji ti okun waya Ejò igboro: idinku ifasilẹ ifoyina-induced ati solderability ti ko dara, ṣiṣe ni ipilẹ fun awọn asopọ itanna ti o nilo iduroṣinṣin igba pipẹ, apejọ irọrun, ati resistance si awọn agbegbe ọriniinitutu / ile-iṣẹ.

    Standard & Awọn iwe-ẹri Ohun elo

    • Adarí ite: T2 Ejò pupa funfun (ni ibamu pẹlu GB/T 3956-2008; deede ASTM B33, IEC 60288 Kilasi 1)
    • Tin aso Standard: GB/T 4910-2009, IEC 60317-2 (laisi asiwaju: Pb ≤0.005%, Sn ≥99.9%)
    • Awọn iwe-ẹri Didara: RoHS 2.0 ifaramọ, ISO 9001 eto iṣakoso didara, ifọwọsi idanwo ayika SGS
    • OlupeseTankii Alloy Ohun elo (15+ ọdun ti Ejò adaorin processing iriri)

    Core Performance Anfani

    1. Pure Red Ejò adaorin: Unmatched Conductivity

    • Electrical Conductivity: ≥98% IACS (20℃), ti o jinna alloyed alloyed Ejò (fun apẹẹrẹ, CuNi alloys: ~ 20% IACS) ati aluminiomu (61% IACS). Ṣe idaniloju idinku foliteji iwonba ni awọn iyika kekere-foliteji (fun apẹẹrẹ, wiwọn adaṣe adaṣe 12V, awọn okun USB 5V) ati gbigbe ifihan agbara iyara fun awọn sensọ.
    • Darí ductility: Elongation ≥30% (25℃) ati agbara fifẹ ≥200 MPa. Le koju atunse ti o leralera (idanwo tẹ 180 ° ≥10 awọn akoko laisi fifọ) fun wiwọ ni awọn aaye wiwọ (fun apẹẹrẹ, awọn yara inu ohun elo, awọn asopọ eti PCB).

    2. 3-5μ Ikọju Tin Tinpe: Idaabobo Ifojusi

    • Anti-Oxidation Idankan duro: Layer tin ti o ni ipon ṣe idena afẹfẹ/ọrinrin lati kan si bàbà, idilọwọ awọn iṣelọpọ ti ohun elo afẹfẹ idẹ (CuO/Cu₂O). Paapaa ni 80% ọriniinitutu fun awọn oṣu 12, okun waya n ṣetọju ≥97% ifarapa akọkọ (la. Bare Ejò: ṣubu si 85% ni awọn oṣu 3).
    • Imudara SolderabilityTin ká kekere yo ojuami (232 ℃) kí "ese wetting" nigba soldering-ko si asọ-ninu tabi ṣiṣan ibere ise ti a beere. Dinku akoko apejọ PCB nipasẹ 40% la.
    • Iwontunwonsi Sisanra Design: 3-5μ sisanra yago fun awọn iwọn meji: awọn awọ ti o kere julọ (<3μ) ko le bo awọn abawọn idẹ, lakoko ti awọn awọ ti o nipọn (> 5μ) jẹ ki okun waya ti o ni okun (ti o ni irọrun si fifun lakoko fifun).

    Imọ ni pato

    Paramita
    Alaye Iye
    Iwọn Opin (Lapapọ)
    1.0mm (adari: ~ 0.992-0.994mm; tin ti a bo: 3-5μ)
    Ifarada Opin
    ± 0.02mm
    Tin Coating Sisanra
    3μ (kere) - 5μ (o pọju); Isokan sisanra: ≥95% (ko si aaye <2.5μ)
    Iṣiṣẹ Itanna (20℃)
    ≥98% IACS
    Agbara fifẹ
    200-250 MPa
    Elongation ni Bireki
    ≥30% (L0=200mm)
    Tin Adhesion
    Ko si peeling/flaking lẹhin 180° tẹ (radius=5mm) + idanwo teepu (teepu 3M 610, ko si iyoku tin)
    Ipata Resistance
    Kọja ASTM B117 idanwo sokiri iyọ (48h, 5% NaCl, 35℃) - ko si ipata pupa, roro tin
    Awọn iwọn otutu ti nṣiṣẹ
    -40℃ (irọra otutu-kekere, ko si wo inu) si 105 ℃ (lilo tẹsiwaju, ko si yo tin)

    Ipese ọja & Isọdi

    Nkan
    Sipesifikesonu
    Fọọmu Ipese
    Ri to adaorin (boṣewa); adaorin ti o ni idaamu (aṣa: 7/0.43mm, 19/0.26mm)
    Iṣeto Spool
    500m/1000m fun spool (ohun elo spool: ṣiṣu ABS, iwọn ila opin: 200mm, iho mojuto: 50mm)
    Dada Ipari
    Tin imọlẹ (aiyipada); matte tin (aṣa, fun awọn ohun elo egboogi-glare)
    Awọn itọju afikun
    Idabobo iyan (PVC/XLPE/Silikoni, sisanra: 0.1-0.3mm, awọ: dudu/pupa/bulu)
    Iṣakojọpọ
    Apo bankanje aluminiomu ti a fi di igbale (ẹri-ọrinrin) + paali ita (pẹlu desiccant, egboogi-ikolu)

    Awọn oju iṣẹlẹ Ohun elo Aṣoju

    • Awọn Ohun elo Ile: Ti abẹnu onirin fun fifọ ẹrọ (ọriniinitutu-sooro), firiji (kekere-iwọn otutu ni irọrun), ati makirowefu ovens (ooru resistance to 105 ℃).
    • Oko Electronics: Awọn ebute asopọ asopọ fun awọn batiri ọkọ ayọkẹlẹ (egboogi-ibajẹ), wiwu sensọ (ifihan iduroṣinṣin), ati awọn eto infotainment ninu ọkọ ayọkẹlẹ (idasilẹ foliteji kekere).
    • PCB & Electronics onibara: Tita nipasẹ iho fun awọn igbimọ Arduino/Rasipibẹri Pi, awọn olutọpa okun USB-C, ati wiwọ adikala LED (apejọ irọrun).
    • Iṣakoso ile ise: Wiwa fun awọn panẹli PLC (itọju ọriniinitutu ile-iṣẹ) ati awọn ipese agbara-kekere (pipadanu agbara ti o kere ju).
    • Awọn Ẹrọ Iṣoogun: Wirin inu inu fun awọn irinṣẹ iwadii to ṣee gbe (laisi asiwaju, ni ibamu pẹlu awọn iṣedede biocompatibility) ati awọn ifasoke iṣoogun kekere (titẹ ni irọrun).

    Imudaniloju Didara lati Ohun elo Tankii Alloy

    Gbogbo ipele ti1.0mm tinned Ejò wayagba awọn ayewo bọtini mẹta:
    1. Idanwo Sisanra Tin: X-ray fluorescence (XRF) atupale (konge: ± 0.1μ) - 5 awọn aaye iṣapẹẹrẹ fun spool.
    1. Idanwo ihuwasi: Ayẹwo oniwadi mẹrin-ojuami (ipeye: ± 0.5% IACS) - Awọn ayẹwo 3 fun ipele.
    1. Idanwo ẹrọ: Ẹrọ idanwo gbogbo agbaye (tensile / elongation) + oluyẹwo tẹ (adhesion) - Awọn ayẹwo 2 fun ipele.
    Awọn ayẹwo ọfẹ (ipari 1m, awọn ege 2-3 fun sipesifikesonu) ati alaye Awọn ijabọ Idanwo Ohun elo (MTR) wa lori ibeere. Ẹgbẹ imọ-ẹrọ wa n pese atilẹyin 1-lori-1 fun awọn ibeere aṣa (fun apẹẹrẹ, yiyan ohun elo idabobo fun awọn ohun elo iwọn otutu giga, apẹrẹ adaorin ti o ni okun fun wiwi rọ).

  • Ti tẹlẹ:
  • Itele:

  • Kọ ifiranṣẹ rẹ nibi ki o si fi si wa