Appicaton:
Ifiweranṣẹ Circuit kekere, igbona igbona ti o lagbara, okun alapapo itanna, okun awọn agolo aladodo, awọn igbona ina
Iṣesi | Olumulo (200C μω.m) | Iwọn otutu Max.ework (0c) | Agbara Tensele (MPA) | Milting (0c) | Iwuwo (g / cm3) | Tr x10-6 / 0c (20 ~ 600 0c) | EMF vs cu (μv / 0c) (0 ~ 100 0c) |
Alloy nomecleture | |||||||
Nc005 (Cuni2) | 0.05 | Ọkẹkọọkan | ≥220 | 1090 | 8,9 | <120 | -12 |
Ejò Ejò Alloy- cuni2
Akoonu kemikali,%
Ni | Mn | Fe | Si | Cu | Omiiran | Rọna Rọna | |||
Cd | Pb | Hg | Cr | ||||||
2 | - | - | - | Bali | - | ND | ND | ND | ND |
Awọn ohun-ini darí
Max tẹsiwaju iṣẹ ibi | 200ºC |
Dide ni 20ºC | 0.05 ± 10% ohm mm2 / m |
Oriri | 8,9 g / cm3 |
Iwari igbona | <120 |
Yo ojuami | 1090ºC |
Agbara Tensele, N / MM2 ANALADED, rirọ | 140 ~ 30 mpa |
Agbara Tensele, N / MM2 tutu ti yiyi | 280 ~ 620 mpa |
Igbesoke (Adigial) | 25% (min) |
Igbesoke (tutu ti yiyi) | 2% (min) |
EMF vs cu, ºC (0 ~ 100ºC) | -12 |
Irisi Micrographic | autinite |
Ohun-ini magi | Ti kii ṣe |